SMTconnect: The next evolution of SMT Hybrid Packaging
Starting in 2019, SMT Hybrid Packaging will have a new name: SMTconnect. While the title of this exhibition and conference is set to change, the proven concept and areas of focus it has relied on for over 30 years will remain in place. The new name expresses what makes the event unique: SMTconnect fosters connections that are made to last.
As a solution-oriented exhibition, SMTconnect seeks to bring the community together under one roof in a common effort to tackle the current challenges in microelectronics. It also puts more of the focus on topics with development potential in order to facilitate valuable, application-based connections among the right contacts in the industry. As of 2019, SMTconnect will also expand its coverage of electronic manufacturing services.